Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes

Recently, various efforts have been made to reduce the environmental burden caused by semiconductor manufacturing by improving the process efficiency. Chemical mechanical polishing (CMP), which is used to planarize thin films in semiconductor production, has also been studied to improve its efficien...

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Detalles Bibliográficos
Autor principal: Lee, Hyunseop
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9966509/
https://www.ncbi.nlm.nih.gov/pubmed/36837971
http://dx.doi.org/10.3390/mi14020272

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9966509/
https://www.ncbi.nlm.nih.gov/pubmed/36837971
http://dx.doi.org/10.3390/mi14020272

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