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Effects of Mask Material on Lateral Undercut of Silicon Dry Etching

The silicon etching process is a core component of production in the semiconductor industry. Undercut is a nonideal effect in silicon dry etching. A reduced undercut is desired when preparing structures that demand a good sidewall morphology, while an enlarged undercut is conducive to the fabricatio...

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Detalles Bibliográficos
Autores principales:	Zhang, Yongkang, Hou, Zhongxuan, Si, Chaowei, Han, Guowei, Zhao, Yongmei, Lu, Xiaorui, Liu, Jiahui, Ning, Jin, Yang, Fuhua
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9966973/ https://www.ncbi.nlm.nih.gov/pubmed/36838006 http://dx.doi.org/10.3390/mi14020306

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