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Polishing Approaches at Atomic and Close-to-Atomic Scale

Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surf...

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Detalles Bibliográficos
Autores principales: Geng, Zhichao, Huang, Ning, Castelli, Marco, Fang, Fengzhou
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9968022/
https://www.ncbi.nlm.nih.gov/pubmed/36838045
http://dx.doi.org/10.3390/mi14020343
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author Geng, Zhichao
Huang, Ning
Castelli, Marco
Fang, Fengzhou
author_facet Geng, Zhichao
Huang, Ning
Castelli, Marco
Fang, Fengzhou
author_sort Geng, Zhichao
collection PubMed
description Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surfaces, including chemical mechanical polishing, plasma-assisted polishing, catalyst-referred etching, bonnet polishing, elastic emission machining, ion beam figuring, magnetorheological finishing, and fluid jet polishing. These polishing approaches are discussed in detail in terms of removal mechanisms, polishing systems, and industrial applications. The authors also offer perspectives for future studies to address existing and potential challenges and promote technological progress.
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spelling pubmed-99680222023-02-27 Polishing Approaches at Atomic and Close-to-Atomic Scale Geng, Zhichao Huang, Ning Castelli, Marco Fang, Fengzhou Micromachines (Basel) Review Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surfaces, including chemical mechanical polishing, plasma-assisted polishing, catalyst-referred etching, bonnet polishing, elastic emission machining, ion beam figuring, magnetorheological finishing, and fluid jet polishing. These polishing approaches are discussed in detail in terms of removal mechanisms, polishing systems, and industrial applications. The authors also offer perspectives for future studies to address existing and potential challenges and promote technological progress. MDPI 2023-01-29 /pmc/articles/PMC9968022/ /pubmed/36838045 http://dx.doi.org/10.3390/mi14020343 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Geng, Zhichao
Huang, Ning
Castelli, Marco
Fang, Fengzhou
Polishing Approaches at Atomic and Close-to-Atomic Scale
title Polishing Approaches at Atomic and Close-to-Atomic Scale
title_full Polishing Approaches at Atomic and Close-to-Atomic Scale
title_fullStr Polishing Approaches at Atomic and Close-to-Atomic Scale
title_full_unstemmed Polishing Approaches at Atomic and Close-to-Atomic Scale
title_short Polishing Approaches at Atomic and Close-to-Atomic Scale
title_sort polishing approaches at atomic and close-to-atomic scale
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9968022/
https://www.ncbi.nlm.nih.gov/pubmed/36838045
http://dx.doi.org/10.3390/mi14020343
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