“…The target active thickness is 150 $\mu$m while two different pixel cell dimensions are currently investigated ($25 \times 100$ and $50 \times 50 \: \mu \rm{m^2}$). Sensors presented in this article have been bump--bonded to the RD53A readout chip (ROC), the first prototype towards the development of a ROC to be employed during HL--LHC operation. …”
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“…The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard $100$~$\mu$m~$\times$~$150$~$\mu$m, down to $50$~$\mu$m~$\times$~$50$~$\mu$m and $25$~$\mu$m~$\times$~$100$~$\mu$m, which are the preferred dimensions in the high pile-up environment of the HL-LHC.…”
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“…The goal of the future test beam campaigns is to quantify the cross talk in the $25 \times 100 \; \mu m^2$ pixel cell sensors that is caused by the bonding scheme of the sensor to the ROC imposed by the different cell area. …”
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