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1por Zuolo, Davide“…The target active thickness is 150 $\mu$m while two different pixel cell dimensions are currently investigated ($25 \times 100$ and $50 \times 50 \: \mu \rm{m^2}$). Sensors presented in this article have been bump--bonded to the RD53A readout chip (ROC), the first prototype towards the development of a ROC to be employed during HL--LHC operation. …”
Publicado 2022
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2por Zoi, Irene, Boscardin, M, Dalla Betta, G. F, Dinardo, Mauro, Giacomini, G, Menasce, Dario, Mendicino, R, Meschini, Marco, Messineo, Alberto, Moroni, Luigi, Ronchin, S, Sultan, D.M.S, Uplegger, Lorenzo, Vernieri, Caterina, Viliani, Lorenzo, Zuolo, Davide“…The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard $100$~$\mu$m~$\times$~$150$~$\mu$m, down to $50$~$\mu$m~$\times$~$50$~$\mu$m and $25$~$\mu$m~$\times$~$100$~$\mu$m, which are the preferred dimensions in the high pile-up environment of the HL-LHC.…”
Publicado 2017
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3por Zuolo, Davide“…The goal of the future test beam campaigns is to quantify the cross talk in the $25 \times 100 \; \mu m^2$ pixel cell sensors that is caused by the bonding scheme of the sensor to the ROC imposed by the different cell area. …”
Publicado 2021
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