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“…Metal-Diamond Composites (Me-CD) are a novel class of materials which has typical applications in the field of thermal management. …”
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“…In this work the preparation of metal photocathodes by physical vapour deposition magnetron sputtering has been employed to deposit metallic thin films onto Cu, Mo and Si substrates. …”
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“…The interaction between high energy particle beams and metals induces a sudden non uniform temperature increase. …”
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“…In this work, the numerical simulations of the LHC high energy particle beam impact against a metal structure are performed using the commercial FEM code LS-DYNA. …”
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“…As a solution for the Ultra High Fluence monitoring, we have focused our research on metal nanolayers. The technology consists of thin film resistive structures deposited on silicon wafers, where sensitivity to displacement damage, measurable in a variation of their electrical properties, can be trimmed by variating geometrical (thickness, W, L) and physical (material) properties of the nanolayers. …”
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“…A new family of materials, with promising features, has been identified: metal-diamond composites. These materials are to combine the outstanding thermal and physical properties of diamond with the electrical and mechanical properties of metals. …”
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“…Both traditional materials (Mo, W and Cu alloys) as well as advanced metal/diamond and metal/graphite composites were tested under extreme conditions as to pressure, density and temperature, leading to the development of highly dynamic phenomena as shock-waves, spallation, explosions. …”
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“…This ADC is characterized by superior power efficiency and small area, realized by employing a lateral metal–metal capacitor array and a dynamic two-stage comparator. …”
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“…A broad variety of materials has been studied, produced and characterized, including metal-diamond composites such as Copper-Diamond, Silver-Diamond, Molybdenum-Diamond as well as Molybdenum-Graphite composites with very promising results. …”
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“…Relevant figures of merit have been identified to classify materials: Metal-diamonds composites look a promising choice as they combine good thermal, structural and stability properties. …”
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“…In addition to increasing the avail- able area the main advantage is in shortening the length of metal connections within the circuitry reducing delays and decreasing power dissipation. …”
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“…Test conditions can be modulated, covering temperature from 400 to 550°C, liquid metal corrosion, cyclical or static stress up to 500 MPa and neutron/proton irradiation damage of up to 25 DPA per annum. …”
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“…Pure tungsten or its alloys(WHA) find applications in several fields, especially due to the fact that these materials show a good combination of mechanical and thermal properties and they are commonly used in aerospace, automotive, metal working processes, military and nuclear technologies. …”
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“…A large variety of pixel sensors compatible with both existing (e.g., ATLAS FEI4 and CMS PSI46) and future (e.g., RD53) read-out chips were fabricated, that were also electrically tested on wafer using a temporary metal layer patterned as strips shorting rows of pixels together. …”
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“…The chip was designed in the 130nm Tezzaron/GF process as a two-tier device with effectively 12 metal layers of routing. It counts about 1,700 transistors in total in 80x80um^2 pixels. …”
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“…This is essentially due to the absence of any segmentation structure between pads (100% fill-factor) and to other two innovative key-features: the first one is a properly doped n+ resistive layer, slowing down the charges just after being multiplied, and the second one is a dielectric layer grown on Silicon, inducing a capacitive coupling on the metal pads deposited on top of the detector. The very good spatial resolution (micron-level) we measured experimentally - higher than the nominal pad pitch - comes from the analogical nature of the readout of signals, whose amplitude attenuates from the pad center to its periphery, while the outstanding results in terms of timing (less than 14 ps, even better than standard LGAD) are due to a combination of very-fine pitch, analogical response and charge multiplication.…”
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“…Depleted monolithic CMOS 1 1 Complementary metal-oxide-semiconductor.  active pixel sensors (DMAPS) have been developed to demonstrate their suitability as pixel detectors in the outer layers of the ATLAS Inner Tracker (ITk) pixel detector in the High-Luminosity Large Hadron Collider (HL-LHC). …”
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