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1“…They are written by physicists, historians of science, and philosophers, and were originally presented at the conference titled Thinking About Space and Time: 100 Years of Applying and Interpreting General Relativity, held at the University of Bern from September 12-14, 2017. …”
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2“…In spite of the very short exposure time (100 sec) the derived bound is comparable to the one found from long XMM-Newton observation.…”
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3“…Main technology performance: extraction beam current >=3.5 mA, beam current on target >=1.5 mA, beam spot <= phi 8mm, stable working time >=100 h.…”
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4“…Among the various options considered, CMS chose to use 3D sensors with a 25\,$\times$\,100 $\mu$m$^2$ pixel cell in the innermost layer of the barrel and planar sensors with a 25\,$\times$\,100 $\mu$m$^2$ pixel cell elsewhere. …”
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5por Jofrehei, Arash, Canelli, Florencia, Kilminster, Ben, Leontsinis, Stefanos, Macchiolo, Anna, Mikuni, Vinicius Massami, Meng, Lingxin“…Crosstalk effects are larger for the $25\times100\ \mu m^2$ geometry, given the larger sensor capacitance. …”
Publicado 2020
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6por Lange, J., Grinstein, S., Manna, M., Pellegrini, G., Quirion, D., Terzo, S., Furelos, D. Vázquez“…A new generation of 3D silicon pixel detectors with a small pixel size of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$ is being developed for the HL-LHC tracker upgrades. …”
Publicado 2018
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7por Steinbrueck, Georg“…Among them is the future version of front-end chips in 65-nm CMOS by the CERN RD53 Collaboration which supports small pixel sizes of 50$\times$50 or 25$\times$100 $\mu$m$^2$} and lower charge thresholds ($\approx1000~\textrm{e}^-$).\\ Thin planar n-in-p type silicon sensors (of thickness 100-150 $\mu$m), segmented into pixel sizes of 25$\times$100 $\mu$m$^2$ or 50$\times$50 $\mu$m$^2$ are expected to allow for a good detector resolution that is expected to be more robust with respect to radiation damage compared to the Phase-1 detector. …”
Publicado 2018
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8por Weisser, Constantin“…Passive $100 \times 100 \,\mu$m test diodes in an unirradiated and an irradiated HV2FEI4v3 HV-CMOS silicon sensor were analysed using the edge TCT technique. …”
Publicado 2014
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9por Dinardo, Mauro“…The basic 3D pixel cell sizes is $25\times100$~$\mu$m$^2$, with one central readout electrode to be connected to the readout chip. …”
Publicado 2022
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10por Jofrehei, A., Backhaus, M., Baertschi, P., Canelli, F., Glessgen, F., Jin, W., Kilminster, B., Macchiolo, A., Reimers, A., Ristic, B., Wallny, R.“…The sensors are designed with a pixel cell of $25\times100\,\mu \mathrm{m}^2$ in case of DC coupled devices and $50\times50\,\mu \mathrm{m}^2$ for the AC coupled ones. …”
Publicado 2021
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11por Steinbrueck, Georg“…Suggested pixel cell geometries to match this requirement are {50$\times$50 }$\mu$m$^2$ or 25$\times$100 $\mu$m$^2$, leaving little space for design choices and a possible biasing scheme. …”
Publicado 2015
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12por Ceccarelli, Rudy“…The basic 3D cell size has an area of $25\times100$ $\mu\mathrm{m^2}$ and is connected to a readout chip through a single, central electrode. …”
Publicado 2023
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13por Antonello, Massimiliano“…All the layers excluding the innermost of the barrel section of the IT will be equipped with planar n-in-p sensors with an active thickness of 150\,$\mu$m and pixel size of 25\,$\mu$m\,$\times$\,100\,$\mu$m. The sensors used for this characterization campaign were coupled to a demonstrator chip (RD53A) and the modules were irradiated to different fluences up to $\Phi_{eq}$\,=\,2\,$\times$\,10$^{16}$\,cm$^{-2}$ and extensively tested in both CERN and DESY test beam facilities over the last three years. …”
Publicado 2022
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14por Hajheidari, Mohammadtaghi“…Planar pixel sensors with an active thickness of $150 \, \mu \text{m}$ and pixel sizes of $25 \times 100 \, \mu \text{m}^2$ or $50 \times 50 \, \mu \text{m}^2$ have been produced by Hamamatsu Photonics (HPK) and Fondazione Bruno Kessler (FBK). …”
Publicado 2021
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15por Zuolo, Davide“…The target active thickness is 150 $\mu$m while two different pixel cell dimensions are currently investigated ($25 \times 100$ and $50 \times 50 \: \mu \rm{m^2}$). Sensors presented in this article have been bump--bonded to the RD53A readout chip (ROC), the first prototype towards the development of a ROC to be employed during HL--LHC operation. …”
Publicado 2022
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16por Luukka, Panja“…The Inner Tracker will be built from thin silicon pixel detectors segmented into pixel sizes of 25 $\times$ 100 $\mu$$\mathrm{ m^2 }$ or 50 $\times$ 50 $\mathrm{ \mu }$$\mathrm{ m^2 } $. …”
Publicado 2020
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17por Zoi, Irene, Boscardin, M, Dalla Betta, G. F, Dinardo, Mauro, Giacomini, G, Menasce, Dario, Mendicino, R, Meschini, Marco, Messineo, Alberto, Moroni, Luigi, Ronchin, S, Sultan, D.M.S, Uplegger, Lorenzo, Vernieri, Caterina, Viliani, Lorenzo, Zuolo, Davide“…The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard $100$~$\mu$m~$\times$~$150$~$\mu$m, down to $50$~$\mu$m~$\times$~$50$~$\mu$m and $25$~$\mu$m~$\times$~$100$~$\mu$m, which are the preferred dimensions in the high pile-up environment of the HL-LHC.…”
Publicado 2017
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18por Zuolo, Davide“…The goal of the future test beam campaigns is to quantify the cross talk in the $25 \times 100 \; \mu m^2$ pixel cell sensors that is caused by the bonding scheme of the sensor to the ROC imposed by the different cell area. …”
Publicado 2021
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