“…They are written by physicists, historians of science, and philosophers, and were originally presented at the conference titled Thinking About Space and Time: 100 Years of Applying and Interpreting General Relativity, held at the University of Bern from September 12-14, 2017. …”
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“…In spite of the very short exposure time (100 sec) the derived bound is comparable to the one found from long XMM-Newton observation.…”
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“…Main technology performance: extraction beam current >=3.5 mA, beam current on target >=1.5 mA, beam spot <= phi 8mm, stable working time >=100 h.…”
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“…Among the various options considered, CMS chose to use 3D sensors with a 25\,$\times$\,100 $\mu$m$^2$ pixel cell in the innermost layer of the barrel and planar sensors with a 25\,$\times$\,100 $\mu$m$^2$ pixel cell elsewhere. …”
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“…Crosstalk effects are larger for the $25\times100\ \mu m^2$ geometry, given the larger sensor capacitance. …”
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“…A new generation of 3D silicon pixel detectors with a small pixel size of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$ is being developed for the HL-LHC tracker upgrades. …”
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“…Among them is the future version of front-end chips in 65-nm CMOS by the CERN RD53 Collaboration which supports small pixel sizes of 50$\times$50 or 25$\times$100 $\mu$m$^2$} and lower charge thresholds ($\approx1000~\textrm{e}^-$).\\ Thin planar n-in-p type silicon sensors (of thickness 100-150 $\mu$m), segmented into pixel sizes of 25$\times$100 $\mu$m$^2$ or 50$\times$50 $\mu$m$^2$ are expected to allow for a good detector resolution that is expected to be more robust with respect to radiation damage compared to the Phase-1 detector. …”
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“…Passive $100 \times 100 \,\mu$m test diodes in an unirradiated and an irradiated HV2FEI4v3 HV-CMOS silicon sensor were analysed using the edge TCT technique. …”
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“…The basic 3D pixel cell sizes is $25\times100$~$\mu$m$^2$, with one central readout electrode to be connected to the readout chip. …”
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“…The sensors are designed with a pixel cell of $25\times100\,\mu \mathrm{m}^2$ in case of DC coupled devices and $50\times50\,\mu \mathrm{m}^2$ for the AC coupled ones. …”
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“…Suggested pixel cell geometries to match this requirement are {50$\times$50 }$\mu$m$^2$ or 25$\times$100 $\mu$m$^2$, leaving little space for design choices and a possible biasing scheme. …”
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“…The basic 3D cell size has an area of $25\times100$ $\mu\mathrm{m^2}$ and is connected to a readout chip through a single, central electrode. …”
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“…All the layers excluding the innermost of the barrel section of the IT will be equipped with planar n-in-p sensors with an active thickness of 150\,$\mu$m and pixel size of 25\,$\mu$m\,$\times$\,100\,$\mu$m. The sensors used for this characterization campaign were coupled to a demonstrator chip (RD53A) and the modules were irradiated to different fluences up to $\Phi_{eq}$\,=\,2\,$\times$\,10$^{16}$\,cm$^{-2}$ and extensively tested in both CERN and DESY test beam facilities over the last three years. …”
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“…Planar pixel sensors with an active thickness of $150 \, \mu \text{m}$ and pixel sizes of $25 \times 100 \, \mu \text{m}^2$ or $50 \times 50 \, \mu \text{m}^2$ have been produced by Hamamatsu Photonics (HPK) and Fondazione Bruno Kessler (FBK). …”
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“…The target active thickness is 150 $\mu$m while two different pixel cell dimensions are currently investigated ($25 \times 100$ and $50 \times 50 \: \mu \rm{m^2}$). Sensors presented in this article have been bump--bonded to the RD53A readout chip (ROC), the first prototype towards the development of a ROC to be employed during HL--LHC operation. …”
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“…The Inner Tracker will be built from thin silicon pixel detectors segmented into pixel sizes of 25 $\times$ 100 $\mu$$\mathrm{ m^2 }$ or 50 $\times$ 50 $\mathrm{ \mu }$$\mathrm{ m^2 } $. …”
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“…The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard $100$~$\mu$m~$\times$~$150$~$\mu$m, down to $50$~$\mu$m~$\times$~$50$~$\mu$m and $25$~$\mu$m~$\times$~$100$~$\mu$m, which are the preferred dimensions in the high pile-up environment of the HL-LHC.…”
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“…The goal of the future test beam campaigns is to quantify the cross talk in the $25 \times 100 \; \mu m^2$ pixel cell sensors that is caused by the bonding scheme of the sensor to the ROC imposed by the different cell area. …”
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