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2601“…Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. …”
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2602“…Grid Integration and Dynamic Impact of Wind Energy details the integration of wind energy resources to the electric grid worldwide. …”
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2603
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2604“…This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. …”
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2605“…Multilayer Integrated Film Bulk Acoustic Resonators mainly introduces the theory, design, fabrication technology and application of a recently developed new type of device, multilayer integrated film bulk acoustic resonators, at the micro and nano scale involving microelectronic devices, integrated circuits, optical devices, sensors and actuators, acoustic resonators, micro-nano manufacturing, multilayer integration, device theory and design principles, etc. …”
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2606
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2607
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2608
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2609
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2610por Brecher, Christian“…Yet, there are many counter-examples in which producing companies dominate their competitors by not only compensating for their specific disadvantages in terms of factor costs (e.g. wages, energy, duties and taxes) but rather by minimising waste using synchronising integrativity as well as by obtaining superior adaptivity on alternating conditions. …”
Publicado 2012
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2611
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2612
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2613
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2614
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2615
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2616
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2617
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2618
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2619
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2620