Mostrando 2,081 - 2,100 Resultados de 5,078 Para Buscar '"Transistor"', tiempo de consulta: 0.32s Limitar resultados
  1. 2081
    “…Tobacco mosaic virus (TMV) has been employed as a robust functional template for the fabrication of a TMV/zinc oxide field effect transistor (FET). A microwave based approach, under mild conditions was employed to synthesize stable zinc oxide (ZnO) nanoparticles, employing a molecular precursor. …”
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  2. 2082
    “…Here, we demonstrate remarkable improvement in the electrical characteristics of single-layer WS(2) field-effect transistor (SL-WS(2) FET) using chemical vapor deposition (CVD)-grown hexagonal BN (h-BN). …”
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  3. 2083
    “…Effect of a polarized P(VDF-TrFE) ferroelectric polymer gating on AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) was investigated. The P(VDF-TrFE) gating in the source/drain access regions of AlGaN/GaN MOS-HEMTs was positively polarized (i.e., partially positively charged hydrogen were aligned to the AlGaN surface) by an applied electric field, resulting in a shift-down of the conduction band at the AlGaN/GaN interface. …”
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  4. 2084
    “…One long-standing goal in the emerging field of flexible and transparent electronic devices is to meet the demand of key markets, such as enhanced output performance for metal oxide semiconductor thin film transistors (TFTs) prepared by a solution process. While solution-based fabrication techniques are cost-effective and ensure large-area coverage at low temperature, their utilization has the disadvantage of introducing large trap states into TFTs. …”
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  5. 2085
    “…An ALD Ga(2)O(3) film was then used as the gate dielectric and surface passivation layer in a metal–oxide–semiconductor high-electron-mobility transistor (MOS-HEMT), which exhibited device performance superior to that of a corresponding conventional Schottky gate HEMT. …”
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  6. 2086
    “…A novel ion-imprinted electrochemical sensor based on AlGaN/GaN high electron mobility transistors (HEMTs) was developed to detect trace amounts of phosphate anion. …”
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  7. 2087
    por Das, Saptarshi
    Publicado 2016
    “…This device, hereafter refer to as two-dimensional electrostrictive field effect transistor or 2D-EFET, allows sub-60 mV/decade subthreshold swing and considerably higher ON current compared to any state of the art FETs. …”
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  8. 2088
    “…We demonstrated modulation of charge carrier densities in all-solution-processed organic field-effect transistors (OFETs) by modifying the injection properties with self-assembled monolayers (SAMs). …”
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  9. 2089
  10. 2090
    “…We report low-temperature solution processing of hafnium oxide (HfO(2)) passivation layers for amorphous indium–gallium–zinc oxide (a-IGZO) thin-film transistors (TFTs). At 150 °C, the hafnium chloride (HfCl(4)) precursor readily hydrolyzed in deionized (DI) water and transformed into an HfO(2) film. …”
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  11. 2091
    “…In this paper, we develop a novel dual-mode gas sensor system which comprises a silicon nanoribbon field effect transistor (Si-NR FET) and a film bulk acoustic resonator (FBAR). …”
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  12. 2092
    “…Ferroelectric field-effect transistors (FeFETs) with single-walled carbon nanotube (SWCNT) dominated micron-wide stripe patterned as channel, (Bi,Nd)(4)Ti(3)O(12) films as insulator, and HfO(2) films as defect control layer were developed and fabricated. …”
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  13. 2093
    “…Low voltage operational organic transistors (< 4 V) based on pentacene were successfully fabricated with hybrid dielectric films composed of aluminum oxide using atomic layer deposition and various phosphonic acid-based self-assembled monolayers as the gate dielectrics. …”
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  14. 2094
    “…In this work, a novel one-transistor dynamic random-access memory (1T DRAM) featuring the device channel with partially inserted wide-bandgap semiconductor material toward the high-temperature application is proposed and designed, and its device performances are investigated with an emphasis at 500 K. …”
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  15. 2095
    “…In this paper, we demonstrate high-mobility inkjet-printed indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs) using a solution-processed Sr-doped Al(2)O(3) (SAO) gate dielectric. …”
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  16. 2096
    “…We investigated the lateral distribution of the equilibrium carrier concentration (n(0)) along the channel and the effects of channel length (L) on the source-drain series resistance (R(ext)) in the top-gate self-aligned (TG-SA) coplanar structure amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs). The lateral distribution of n(0) across the channel was extracted using the paired gate-to-source voltage (V(GS))-based transmission line method and the temperature-dependent transfer characteristics obtained from the TFTs with different Ls. n(0) abruptly decreased with an increase in the distance from the channel edge near the source/drain junctions; however, much smaller gradient of n(0) was observed in the region near the middle of the channel. …”
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  17. 2097
    “…[Image: see text] The key impact and significance of a multilayer polymer-based dielectric system on the remarkable photoresponse properties of zinc phthalocyanine (ZnPc)-based photosensitive organic field-effect transistors (PS-OFETs) have been systematically analyzed at various incident optical powers. …”
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  18. 2098
    “…Higher substrate temperature during deposition of the DTmBDT derivatives with aromatic end-caps results in larger domains and improved the transistor mobilities but not beyond the alkylated DTmBDT.…”
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  19. 2099
    “…Two-dimensional (2D) InSe-based field effect transistor (FET) has shown remarkable carrier mobility and high on-off ratio in experimental reports. …”
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  20. 2100
    por Ye, Shujun, Yamabe, Kikuo, Endoh, Tetsuo
    Publicado 2019
    “…In this work, uniform sub-20 nm Si nanopillar (NP) arrays with a reduced diameter variance (to ±0.5 nm) and a cylindrical shape, which can be used for vertical gate-all-around metal-oxide-semiconductor field-effect transistors, were fabricated. For the fabrication process, an array of tapered Si NPs with a diameter of approximately 62.7 nm and a diameter variance of ±2.0 nm was initially fabricated by an argon fluoride lithography followed by dry etching. …”
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