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Circuitos integrados
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281por ATLAS Collaboration“…To achieve the required performance Fast TracKer uses a combination of custom designed VLSI chips and latest generation FPGAs, all embedded in custom designed boards, exploiting a fully parallel architecture. …”
Publicado 2016
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282por Stabile, Alberto“…To achieve the required performance Fast TracKer uses a combination of custom designed VLSI chips and latest generation FPGAs, all embedded in custom designed boards, exploiting a fully parallel architecture. …”
Publicado 2016
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283por Posch, Christoph“…--HTML--><p>Neuromorphic event-based vision is an emerging paradigm of acquisition and processing of visual information that takes inspiration from the functioning of the human vision system, attempting to recreate Nature's visual information acquisition and processing on VLSI silicon. In contrast to conventional image sensors, event vision sensors do not use a common sampling rate (=frame rate) for all pixels, but each individual pixel autonomously defines the timing of its own sampling points in response to its visual input by reacting to changes of incident light in continuous time. …”
Publicado 2023
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284por Bonvicini, V, Busso, L, Giubellino, P, Gregorio, A, Idzik, M, Kolojvari, A A, Montaño-Zetina, L M, Nouais, D, Petta, C, Rashevsky, A, Randazzo, N, Reito, S, Tosello, F, Vacchi, A, Vinogradov, L I, Zampa, N“…The device was also tested in a pion beam (at the CERN PS) tagged by means of a microstrip detector telescope. Bipolar VLSI front-end cells featuring a noise of 250 e/sup -/ RMS at 0 pF with a slope of 40 e/sup -//pF have been used to read out the signals. …”
Publicado 2000
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285“…In this paper we present a neuromorphic VLSI device, the “Selective Attention Chip” (SAC), which can be used to implement these models in multi-chip address-event systems. …”
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286por González, Diego, Botella, Guillermo, Meyer-Baese, Uwe, García, Carlos, Sanz, Concepción, Prieto-Matías, Manuel, Tirado, Francisco“…The design, which involves several matching algorithms, is mapped using Very Large Scale Integration (VLSI) technology. These algorithms, as well as the hardware implementation, are presented here together with an extensive analysis of the resources needed and the throughput obtained. …”
Publicado 2012
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287“…The increasing integration of microelectronics into the submicrometer region for VHSIC and VLSI applications necessitates the examination of these structures both for linewidth measurement and defect inspection by systems other than the optical microscope. …”
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288“…In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. …”
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289“…We hope that this book will highlight the ideas that have been pioneered by the authors, while providing a roadmap for new practitioners in this field to exploit exciting opportunities to integrate imaging and “smartness” on a single VLSI chip. The potential of these smart imaging systems is still unfulfilled. …”
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290por Vempala, Santosh S“…The first group consists of combinatorial optimization problems such as maxcut, graph coloring, minimum multicut, graph bandwidth and VLSI layout. Presented in this context is the theory of Euclidean embeddings of graphs. …”
Publicado 2005
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291por Nappi, E, Posa, F, Satalino, G, Scognetti, T, Tomasicchio, G, Braem, André, Chesi, Enrico Guido, Paic, G, Piuz, François, Schükraft, Jürgen, Ferreira-Marques, R, Policarpo, Armando, Ribeiro, R S, Kühn, W, Novotny, R, Friese, J, Sartori, P, Ljubicic, A, Vranic, D“…The main objectives are: - to develop a complete chain of adequate techniques for deposition of photo- sensitive materials (CsI and similar) on pad electrodes - to optimize the detector for photon detection efficiency, noise contributions, and radiation thickness - to develop a specific VLSI front end electronics matched to pad readout of MWPC's with a large number of channels. …”
Publicado 1992
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292por Fischer, P“…The basic building blocks are pixel modules with an active area of 16.4 mm*60.8 mm which include an n/sup +/ on n-type silicon sensor and 16 VLSI front-end (FE) chips. Every FE chip contains a low power, high speed charge sensitive preamplifier, a fast discriminator, and a readout system which operates at the 40 MHz rate of LHC. …”
Publicado 2001
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293“…The bioinspired sensor has been designed for Very Large Scale Integration (VLSI) using properties of the mammalian cortical motion pathway. …”
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294por Amoretti, Michele“…Networks on-chip (NoCs) provide enhanced performance, scalability, modularity, and design productivity as compared with previous communication architectures for VLSI systems on-chip (SoCs), such as buses and dedicated signal wires. …”
Publicado 2014
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295“…Conventional lithography-based VLSI design technology deployed to optimize low-powered-computing and higher scale integration of semiconductor components. …”
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296por Fadl, Omnia S., Abu-Elyazeed, Mohamed F., Abdelhalim, Mohamed B., Amer, Hassanein H., Madian, Ahmed H.“…Dynamic power estimation is essential in designing VLSI circuits where many parameters are involved but the only circuit parameter that is related to the circuit operation is the nodes’ toggle rate. …”
Publicado 2016
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297“…Contributions from the areas such as Embedded Systems, RFID, RF MEMS, VLSI Design & Electronic Devices, Analog and Mixed-Signal IC Design and Testing, MEMS and Microsystems, CMOS MEMS, Solar Cells and Photonics, Nano Devices, Single Electron & Spintronics Devices, Space Electronics, and Intelligent Robotics are covered in this volume.…”
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298“…On the one extreme, these applications are in the submicron dimensions in such areas as very large scale integration (VLSI), Josephson junction quantum interference devices, magnetic bubbles, and integrated optics. …”
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299“…This book is an up-to-date and comprehensive introduction for students in courses on memory circuit design or advanced digital courses in VLSI or CMOS circuit design. It also serves as an essential, one-stop resource for academics, researchers and practicing engineers.…”
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300“…The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. …”
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