Mostrando 781 - 800 Resultados de 29,722 Para Buscar '"chip"', tiempo de consulta: 0.28s Limitar resultados
  1. 781
  2. 782
  3. 783
  4. 784
    “…The 12*63 pixel readout prototype chip Bieu&Pastis, designed to cope with the environment imposed on a pixel detector by high-energy proton-proton collisions as expected at the Large Hadron Collider (LHC), is described. …”
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    Enlace del recurso
  5. 785
  6. 786
  7. 787
    “…Application of super thermoconductive carbon fibre thin plates provides a practical solution for the development of miniature motherboards for the FEE chips situated inside the sensitive ITS volume. Unidirectional carbon fibre motherboards of 160 -300 micron thickness ensure the mounting of the FEE chips and an efficient heat sink to the cooling arteries. …”
    Enlace del recurso
    Enlace del recurso
  8. 788
  9. 789
    “…The design and test of three prototypes of the CERN and Rio Current- mode Amplifier (CARIOCA) front-end chips for the LHCb muon wire chambers was presented. …”
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    Enlace del recurso
  10. 790
    por Friedl, M, Bauer, T, Pernicka, Manfred
    Publicado 2003
    “…About ten million channels will be read out by APV25 front-end chips, fabricated in the 0.25 mum deep submicron process. …”
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    Enlace del recurso
  11. 791
    Publicado 2002
    “…SEM picture of bump bonding pads on ALICE readout chip…”
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  12. 792
    por Flacco, C J, Ciocio, A, Fadeev, V
    Publicado 2001
    “…For the purpose of reducing the testing time of the ABCD3T chip wafers for the ATLAS SCT, we need to optimize the values of the repetition parameters and the sequence of tests involved in both analogue and digital measurements of the chip. …”
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  13. 793
    por Gromov, V, Sluijk, T
    Publicado 2000
    “…2000-054 Operational properties of the ASDBLR chip have been studied in view of its intended use as front-end chip for the LHCb Outer TRacker. …”
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  14. 794
    “…These highly ionising events have been observed to cause measurable deadtime in the CMS Tracker APV25 front-end readout chip. An analysis of beam test data and a simulation of the effect in the laboratory have provided measurements of both the rate at which non-negligible deadtime is observed and the deadtime resulting from a highly ionising event. …”
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  15. 795
  16. 796
    “…Two Beetle1.1 chips, bonded to a Hamamatsu PR01 VELO Phi-detector, have been tested for the first time in a testbeam. …”
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  17. 797
    por Alessandro, B.
    Publicado 2004
    “…Front-end chip cable and jif on Delvotec (bonding machine).…”
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  18. 798
    Publicado 2004
    “…Readout plane of the TRD equipped with 3 multi chip modules…”
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  19. 799
  20. 800
    “…In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. …”
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