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781por Braun, G., Fischer, H., Franz, J., Grunemaier, A., Heinsius, F.H., Konigsmann, Kay, Schierloh, M., Schmidt, T., Schmitt, H., Urban, H.J.“…A new TDC-chip is under development for the COMPASS experiment at CERN. …”
Publicado 1998
Enlace del recurso
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782
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783
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784por Berg, C, Blanquart, L, Bonzom, V, Delpierre, P A, Desch, Klaus, Fischer, P, Keil, M, Meuser, S, Raith, B A, Wermes, N“…The 12*63 pixel readout prototype chip Bieu&Pastis, designed to cope with the environment imposed on a pixel detector by high-energy proton-proton collisions as expected at the Large Hadron Collider (LHC), is described. …”
Publicado 2000
Enlace del recurso
Enlace del recurso
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785
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786
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787por Van den Brink, A, Coli, S, Daudo, F, Feofilov, G A, Godisov, O N, Giraudo, G, Igolkin, S N, Kuijer, P, Nooren, G J L, Swichev, A, Tosello, F“…Application of super thermoconductive carbon fibre thin plates provides a practical solution for the development of miniature motherboards for the FEE chips situated inside the sensitive ITS volume. Unidirectional carbon fibre motherboards of 160 -300 micron thickness ensure the mounting of the FEE chips and an efficient heat sink to the cooling arteries. …”
Publicado 2001
Enlace del recurso
Enlace del recurso
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788
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789“…The design and test of three prototypes of the CERN and Rio Current- mode Amplifier (CARIOCA) front-end chips for the LHCb muon wire chambers was presented. …”
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Enlace del recurso
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790“…About ten million channels will be read out by APV25 front-end chips, fabricated in the 0.25 mum deep submicron process. …”
Enlace del recurso
Enlace del recurso
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791
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792“…For the purpose of reducing the testing time of the ABCD3T chip wafers for the ATLAS SCT, we need to optimize the values of the repetition parameters and the sequence of tests involved in both analogue and digital measurements of the chip. …”
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793“…2000-054 Operational properties of the ASDBLR chip have been studied in view of its intended use as front-end chip for the LHCb Outer TRacker. …”
Enlace del recurso
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794por Bainbridge, Robert, Chierici, Roberto, Hall, Geoffrey, Mirabito, Laurent, Raymond, M“…These highly ionising events have been observed to cause measurable deadtime in the CMS Tracker APV25 front-end readout chip. An analysis of beam test data and a simulation of the effect in the laboratory have provided measurements of both the rate at which non-negligible deadtime is observed and the deadtime resulting from a highly ionising event. …”
Publicado 2002
Enlace del recurso
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795
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796por Van Bakel, N, Van Beuzekom, M G, Bulten, H J, Jans, E, Ketel, T, Klous, S, Snoek, H, Verkooijen, H“…Two Beetle1.1 chips, bonded to a Hamamatsu PR01 VELO Phi-detector, have been tested for the first time in a testbeam. …”
Publicado 2003
Enlace del recurso
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797por Alessandro, B.“…Front-end chip cable and jif on Delvotec (bonding machine).…”
Publicado 2004
Enlace del recurso
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798
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799por Agari, M, Van Bakel, N, Bauer, C, Baumeister, D, Van Beuzekom, M G, Feuerstack-Raible, M, Harnew, N, Hofmann, W, Jans, E, Klous, S, Knöpfle, K T, Löchner, S, Schmelling, M, Sexauer, E, Smale, N J, Trunk, U, Verkooijen, H“…A new radiation hard pipelined readout chip is being developed for the LHCb-experiment. …”
Publicado 2004
Enlace del recurso
Enlace del recurso
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800por Cinausero, M, Fioretto, E, Antinori, F, Chochula, P, Dinapoli, R, Dima, R, Fabris, D, Galet, G, Lunardon, M, Manea, C, Marchini, S, Martini, S, Moretto, S, Pepato, Adriano, Prete, G, Riedler, P, Scarlassara, F, Segato, G F, Soramel, F, Stefanini, G, Turrisi, R, Vannucci, L, Viesti, G“…In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. …”
Publicado 2004
Enlace del recurso