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“…It offers an up-to-date review of continuum mechanical description of soft and biological materials from the basics to the latest scientific materials. …”
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“…It reviews the principal physical processes of fast-particle interactions with matter, effects in materials under irradiation, materials response, related to component lifetime and performance, simulation techniques, and methods of mitigating the impact of radiation on the components and envir onment in challenging current and future application…”
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“…The book offers an in-depth review of the materials design and manufacturing processes employed in the development of multi-component or multiphase polymer material systems. …”
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“…Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. …”
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“…The materials studied include ZnS, TiO2, NiO, Ga doped ZnO, Mn doped SnO2, Mn doped CeO2 and Mn doped ZrO2.…”
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“…This book deals with experimental results of the physical characterization of several important, dielectric materials of great current interest. The experimental tools used for the analysis of these materials include X-ray diffraction, dielectric measurements, magnetic measurements using a vibrating sample magnetometer, optical measurements using a UV-Visible spectrometer etc.…”
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“…This book presents the concept of functionally graded materials as well as their use and different fabrication processes. …”
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“…This book shows impressively how complex mathematical modeling of materials can be applied to technological problems. …”
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