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3D Circuit Integration for High Energy Physics

Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D d...

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Detalles Bibliográficos
Autor principal: Yarema, Ray
Lenguaje:eng
Publicado: CERN 2007
Materias:
Acceso en línea:https://dx.doi.org/10.5170/CERN-2007-001.71
http://cds.cern.ch/record/1027415