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3D Circuit Integration for High Energy Physics
Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D d...
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| Lenguaje: | eng |
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CERN
2007
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| Acceso en línea: | https://dx.doi.org/10.5170/CERN-2007-001.71 http://cds.cern.ch/record/1027415 |
| Sumario: | Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D demonstrator chip for the ILC is presented. |
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