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VELO Module Production - Back End Bonding
This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules.
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
2007
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1067143 |