VELO Module Production - Back End Bonding

This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules.

Detalles Bibliográficos
Autores principales: Whitley, M, Wormald, M
Lenguaje:eng
Publicado: 2007
Materias:
Detectors and Experimental Techniques
Acceso en línea:http://cds.cern.ch/record/1067143
Descripción
Sumario:This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules.

Ejemplares similares