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VELO Module Production - Back End Bonding
This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules.
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
2007
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1067143 |
| _version_ | 1780913292831621120 |
|---|---|
| author | Whitley, M Wormald, M |
| author_facet | Whitley, M Wormald, M |
| author_sort | Whitley, M |
| collection | CERN |
| description | This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules. |
| id | cern-1067143 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2007 |
| record_format | invenio |
| spelling | cern-10671432019-09-30T06:29:59Zhttp://cds.cern.ch/record/1067143engWhitley, MWormald, MVELO Module Production - Back End BondingDetectors and Experimental TechniquesThis note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules.LHCb-2007-078CERN-LHCb-2007-078oai:cds.cern.ch:10671432007-11-06 |
| spellingShingle | Detectors and Experimental Techniques Whitley, M Wormald, M VELO Module Production - Back End Bonding |
| title | VELO Module Production - Back End Bonding |
| title_full | VELO Module Production - Back End Bonding |
| title_fullStr | VELO Module Production - Back End Bonding |
| title_full_unstemmed | VELO Module Production - Back End Bonding |
| title_short | VELO Module Production - Back End Bonding |
| title_sort | velo module production - back end bonding |
| topic | Detectors and Experimental Techniques |
| url | http://cds.cern.ch/record/1067143 |
| work_keys_str_mv | AT whitleym velomoduleproductionbackendbonding AT wormaldm velomoduleproductionbackendbonding |