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Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies
| Autor principal: | |
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| Lenguaje: | eng |
| Publicado: |
Elsevier
2001
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1084588 |
| _version_ | 1780913587344113664 |
|---|---|
| author | Lee, Ning-Cheng |
| author_facet | Lee, Ning-Cheng |
| author_sort | Lee, Ning-Cheng |
| collection | CERN |
| id | cern-1084588 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2001 |
| publisher | Elsevier |
| record_format | invenio |
| spelling | cern-10845882020-07-16T20:01:43Zhttp://cds.cern.ch/record/1084588engLee, Ning-ChengReflow Soldering Processes: SMT, BGA, CSP and Flip Chip TechnologiesEngineeringElsevieroai:cds.cern.ch:10845882001 |
| spellingShingle | Engineering Lee, Ning-Cheng Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies |
| title | Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies |
| title_full | Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies |
| title_fullStr | Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies |
| title_full_unstemmed | Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies |
| title_short | Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies |
| title_sort | reflow soldering processes: smt, bga, csp and flip chip technologies |
| topic | Engineering |
| url | http://cds.cern.ch/record/1084588 |
| work_keys_str_mv | AT leeningcheng reflowsolderingprocessessmtbgacspandflipchiptechnologies |