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Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies

Detalles Bibliográficos
Autor principal:	Lee, Ning-Cheng
Lenguaje:	eng
Publicado:	Elsevier 2001
Materias:	Engineering
Acceso en línea:	http://cds.cern.ch/record/1084588

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