Electronic packaging: design, materials, process, and reliability

Detalles Bibliográficos
Autores principales: Lau, John H, Wong, C P, Prince, John L, Nakayama, Wataru
Lenguaje:eng
Publicado: McGraw-Hill 1998
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/1191389

Internet

http://cds.cern.ch/record/1191389

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