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Electronic packaging: design, materials, process, and reliability
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
McGraw-Hill
1998
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1191389 |
| _version_ | 1780916618082123776 |
|---|---|
| author | Lau, John H Wong, C P Prince, John L Nakayama, Wataru |
| author_facet | Lau, John H Wong, C P Prince, John L Nakayama, Wataru |
| author_sort | Lau, John H |
| collection | CERN |
| id | cern-1191389 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 1998 |
| publisher | McGraw-Hill |
| record_format | invenio |
| spelling | cern-11913892021-04-22T01:34:07Zhttp://cds.cern.ch/record/1191389engLau, John HWong, C PPrince, John LNakayama, WataruElectronic packaging: design, materials, process, and reliabilityEngineeringMcGraw-Hilloai:cds.cern.ch:11913891998 |
| spellingShingle | Engineering Lau, John H Wong, C P Prince, John L Nakayama, Wataru Electronic packaging: design, materials, process, and reliability |
| title | Electronic packaging: design, materials, process, and reliability |
| title_full | Electronic packaging: design, materials, process, and reliability |
| title_fullStr | Electronic packaging: design, materials, process, and reliability |
| title_full_unstemmed | Electronic packaging: design, materials, process, and reliability |
| title_short | Electronic packaging: design, materials, process, and reliability |
| title_sort | electronic packaging: design, materials, process, and reliability |
| topic | Engineering |
| url | http://cds.cern.ch/record/1191389 |
| work_keys_str_mv | AT laujohnh electronicpackagingdesignmaterialsprocessandreliability AT wongcp electronicpackagingdesignmaterialsprocessandreliability AT princejohnl electronicpackagingdesignmaterialsprocessandreliability AT nakayamawataru electronicpackagingdesignmaterialsprocessandreliability |