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Electronic packaging: design, materials, process, and reliability

Detalles Bibliográficos
Autores principales:	Lau, John H, Wong, C P, Prince, John L, Nakayama, Wataru
Lenguaje:	eng
Publicado:	McGraw-Hill 1998
Materias:	Engineering
Acceso en línea:	http://cds.cern.ch/record/1191389

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