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Wafer Screening of ABCN-25 readout ASIC
The ABCN-25 chip was fabricated in 2008 in the IBM 0.25 micron CMOS process. One wafer was immediately diced to make chips available for evaluation with test PCBs and hybrids, programmes which are reported separately to this conference. A second wafer was later diced untested to ensure continuity of...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
CERN
2009
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.5170/CERN-2009-006.529 http://cds.cern.ch/record/1235876 |