Wafer Screening of ABCN-25 readout ASIC

The ABCN-25 chip was fabricated in 2008 in the IBM 0.25 micron CMOS process. One wafer was immediately diced to make chips available for evaluation with test PCBs and hybrids, programmes which are reported separately to this conference. A second wafer was later diced untested to ensure continuity of...

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Detalles Bibliográficos
Autores principales: Phillips, Peter W, Gallop, Bruce, Matson, Richard, Shaw, Richard
Lenguaje:eng
Publicado: CERN 2009
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.5170/CERN-2009-006.529
http://cds.cern.ch/record/1235876
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author Phillips, Peter W
Gallop, Bruce
Matson, Richard
Shaw, Richard
author_facet Phillips, Peter W
Gallop, Bruce
Matson, Richard
Shaw, Richard
author_sort Phillips, Peter W
collection CERN
description The ABCN-25 chip was fabricated in 2008 in the IBM 0.25 micron CMOS process. One wafer was immediately diced to make chips available for evaluation with test PCBs and hybrids, programmes which are reported separately to this conference. A second wafer was later diced untested to ensure continuity of supply. Early indications based on the first diced wafer suggested a percentage yield of more than 95%, however the community decided to screen the remaining wafers such that faulty die could be excluded from the module construction programme. This paper documents the test hardware, software and procedures used to perform the screening. An overview of results is also given.
id cern-1235876
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2009
publisher CERN
record_format invenio
spelling cern-12358762019-09-30T06:29:59Zdoi:10.5170/CERN-2009-006.529http://cds.cern.ch/record/1235876engPhillips, Peter WGallop, BruceMatson, RichardShaw, RichardWafer Screening of ABCN-25 readout ASICDetectors and Experimental TechniquesThe ABCN-25 chip was fabricated in 2008 in the IBM 0.25 micron CMOS process. One wafer was immediately diced to make chips available for evaluation with test PCBs and hybrids, programmes which are reported separately to this conference. A second wafer was later diced untested to ensure continuity of supply. Early indications based on the first diced wafer suggested a percentage yield of more than 95%, however the community decided to screen the remaining wafers such that faulty die could be excluded from the module construction programme. This paper documents the test hardware, software and procedures used to perform the screening. An overview of results is also given.CERNoai:cds.cern.ch:12358762009
spellingShingle Detectors and Experimental Techniques
Phillips, Peter W
Gallop, Bruce
Matson, Richard
Shaw, Richard
Wafer Screening of ABCN-25 readout ASIC
title Wafer Screening of ABCN-25 readout ASIC
title_full Wafer Screening of ABCN-25 readout ASIC
title_fullStr Wafer Screening of ABCN-25 readout ASIC
title_full_unstemmed Wafer Screening of ABCN-25 readout ASIC
title_short Wafer Screening of ABCN-25 readout ASIC
title_sort wafer screening of abcn-25 readout asic
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.5170/CERN-2009-006.529
http://cds.cern.ch/record/1235876
work_keys_str_mv AT phillipspeterw waferscreeningofabcn25readoutasic
AT gallopbruce waferscreeningofabcn25readoutasic
AT matsonrichard waferscreeningofabcn25readoutasic
AT shawrichard waferscreeningofabcn25readoutasic

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