Thermal analysis of MegaDiscaP semiconductor devices

This technical report presents a thermal analysis of MegaDiscaP semiconductor devices. This analysis evaluates the thermal cycling of representative devices in order to estimate the expected lifetime. Simulation results based on manufacturer specifications are presented.

Detalles Bibliográficos
Autores principales: Cravero, Jean-Marc, Benedetti, Mario, Garcia Retegui, Rogelio, Maestri, Sebastian, Wassinger, Nicolas
Lenguaje:eng
Publicado: 2011
Materias:
Accelerators and Storage Rings
Acceso en línea:http://cds.cern.ch/record/1331507

Internet

http://cds.cern.ch/record/1331507

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