Low-cost bump bonding activities at CERN

Detalles Bibliográficos
Autores principales: Vahanen, S, Tick, T, Campbell, M
Publicado: 2010
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/5/11/C11008
http://cds.cern.ch/record/1352700

Internet

https://dx.doi.org/10.1088/1748-0221/5/11/C11008
http://cds.cern.ch/record/1352700

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