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Low-cost bump bonding activities at CERN

Detalles Bibliográficos
Autores principales: Vahanen, S, Tick, T, Campbell, M
Publicado: 2010
Materias:
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/5/11/C11008
http://cds.cern.ch/record/1352700
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author Vahanen, S
Tick, T
Campbell, M
author_facet Vahanen, S
Tick, T
Campbell, M
author_sort Vahanen, S
collection CERN
id cern-1352700
institution Organización Europea para la Investigación Nuclear
publishDate 2010
record_format invenio
spelling cern-13527002019-09-30T06:29:59Zdoi:10.1088/1748-0221/5/11/C11008http://cds.cern.ch/record/1352700Vahanen, STick, TCampbell, MLow-cost bump bonding activities at CERNDetectors and Experimental Techniquesoai:cds.cern.ch:13527002010
spellingShingle Detectors and Experimental Techniques
Vahanen, S
Tick, T
Campbell, M
Low-cost bump bonding activities at CERN
title Low-cost bump bonding activities at CERN
title_full Low-cost bump bonding activities at CERN
title_fullStr Low-cost bump bonding activities at CERN
title_full_unstemmed Low-cost bump bonding activities at CERN
title_short Low-cost bump bonding activities at CERN
title_sort low-cost bump bonding activities at cern
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1088/1748-0221/5/11/C11008
http://cds.cern.ch/record/1352700
work_keys_str_mv AT vahanens lowcostbumpbondingactivitiesatcern
AT tickt lowcostbumpbondingactivitiesatcern
AT campbellm lowcostbumpbondingactivitiesatcern