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Low-cost bump bonding activities at CERN

Detalles Bibliográficos
Autores principales:	Vahanen, S, Tick, T, Campbell, M
Publicado:	2010
Materias:	Detectors and Experimental Techniques
Acceso en línea:	https://dx.doi.org/10.1088/1748-0221/5/11/C11008 http://cds.cern.ch/record/1352700

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