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A Study of the Surface Quality of High Purity Copper after Heat Treatment
Themanufacturing flow of accelerating structures for the compact linear collider, based on diamond-machined high purity copper components, include several thermal cycles (diffusion bonding, brazing of cooling circuits, baking in vacuum, etc.). The high temperature cycles may be carried out following...
| Autores principales: | , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2011
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1405001 |