Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC

Detalles Bibliográficos
Autor principal: Li, Er-Ping
Lenguaje:eng
Publicado: Wiley-IEEE Press 2012
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/1480658

Internet

http://cds.cern.ch/record/1480658

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