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Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC
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Lenguaje: | eng |
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Wiley-IEEE Press
2012
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Acceso en línea: | http://cds.cern.ch/record/1480658 |
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author | Li, Er-Ping |
author_facet | Li, Er-Ping |
author_sort | Li, Er-Ping |
collection | CERN |
id | cern-1480658 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2012 |
publisher | Wiley-IEEE Press |
record_format | invenio |
spelling | cern-14806582021-04-22T00:24:49Zhttp://cds.cern.ch/record/1480658engLi, Er-PingElectrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMCEngineeringWiley-IEEE Pressoai:cds.cern.ch:14806582012 |
spellingShingle | Engineering Li, Er-Ping Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC |
title | Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC |
title_full | Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC |
title_fullStr | Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC |
title_full_unstemmed | Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC |
title_short | Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity power integrity and EMC |
title_sort | electrical modeling and design for 3d system integration: 3d integrated circuits and packaging signal integrity power integrity and emc |
topic | Engineering |
url | http://cds.cern.ch/record/1480658 |
work_keys_str_mv | AT lierping electricalmodelinganddesignfor3dsystemintegration3dintegratedcircuitsandpackagingsignalintegritypowerintegrityandemc |