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Advanced flip chip packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...
| Autores principales: | , , |
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| Lenguaje: | eng |
| Publicado: |
Springer
2013
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4419-5768-9 http://cds.cern.ch/record/1537705 |