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Electromigration modeling at circuit layout level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has...

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Detalles Bibliográficos
Autores principales: Tan, Cher Ming, He, Feifei
Lenguaje:eng
Publicado: Springer 2013
Materias:
Acceso en línea:https://dx.doi.org/10.1007/978-981-4451-21-5
http://cds.cern.ch/record/1537793