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WAFER POSTPROCESSING (THINNING, TSV)
| Autor principal: | |
|---|---|
| Formato: | info:eu-repo/semantics/article |
| Lenguaje: | eng |
| Publicado: |
2013
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1566127 |
| _version_ | 1780930955068833792 |
|---|---|
| author | Moser, Hans-Gunther |
| author_facet | Moser, Hans-Gunther |
| author_sort | Moser, Hans-Gunther |
| collection | CERN |
| format | info:eu-repo/semantics/article |
| id | cern-1566127 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2013 |
| record_format | invenio |
| spelling | cern-15661272019-09-30T06:29:59Z http://cds.cern.ch/record/1566127 eng Moser, Hans-Gunther WAFER POSTPROCESSING (THINNING, TSV) Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection info:eu-repo/grantAgreement/EC/FP7/262025 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/1566127 2013 |
| spellingShingle | Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection Moser, Hans-Gunther WAFER POSTPROCESSING (THINNING, TSV) |
| title | WAFER POSTPROCESSING (THINNING, TSV) |
| title_full | WAFER POSTPROCESSING (THINNING, TSV) |
| title_fullStr | WAFER POSTPROCESSING (THINNING, TSV) |
| title_full_unstemmed | WAFER POSTPROCESSING (THINNING, TSV) |
| title_short | WAFER POSTPROCESSING (THINNING, TSV) |
| title_sort | wafer postprocessing (thinning, tsv) |
| topic | Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection |
| url | http://cds.cern.ch/record/1566127 http://cds.cern.ch/record/1566127 |
| work_keys_str_mv | AT moserhansgunther waferpostprocessingthinningtsv |