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Integrated interconnect technologies for 3D nanoelectronic systems

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.

Detalles Bibliográficos
Autores principales: Bakir, Muhannad S, Meindl, James D
Lenguaje:eng
Publicado: Artech House 2008
Materias:
Acceso en línea:http://cds.cern.ch/record/1608381