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Integrated interconnect technologies for 3D nanoelectronic systems
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.
Autores principales: | Bakir, Muhannad S, Meindl, James D |
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Lenguaje: | eng |
Publicado: |
Artech House
2008
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/1608381 |
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