Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT (Finland) with an active edge technology, which considerably...

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Detalles Bibliográficos
Autores principales: Macchiolo, A., Andricek, L., Moser, H.-G., Nisius, R., Richter, R.H., Terzo, S., Weigell, P.
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Nucl. Instrum. Methods Phys. Res., A 2013
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2014.06.073
http://cds.cern.ch/record/1612324

Internet

https://dx.doi.org/10.1016/j.nima.2014.06.073
http://cds.cern.ch/record/1612324

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