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Handbook of wafer bonding

Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most...

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Detalles Bibliográficos
Autores principales: Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M V
Lenguaje:eng
Publicado: Wiley 2011
Materias:
Acceso en línea:https://dx.doi.org/10.1002/9783527644223
http://cds.cern.ch/record/1613990