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Handbook of wafer bonding

Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most...

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Detalles Bibliográficos
Autores principales: Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M V
Lenguaje:eng
Publicado: Wiley 2011
Materias:
Acceso en línea:https://dx.doi.org/10.1002/9783527644223
http://cds.cern.ch/record/1613990
Descripción
Sumario:Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.