Handbook of wafer bonding

Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most...

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Detalles Bibliográficos
Autores principales: Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M V
Lenguaje:eng
Publicado: Wiley 2011
Materias:
Engineering
Acceso en línea:https://dx.doi.org/10.1002/9783527644223
http://cds.cern.ch/record/1613990
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author Ramm, Peter
Lu, James Jian-Qiang
Taklo, Maaike M V
author_facet Ramm, Peter
Lu, James Jian-Qiang
Taklo, Maaike M V
author_sort Ramm, Peter
collection CERN
description Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
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institution Organización Europea para la Investigación Nuclear
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publishDate 2011
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spelling cern-16139902021-04-21T22:10:47Zdoi:10.1002/9783527644223http://cds.cern.ch/record/1613990engRamm, PeterLu, James Jian-QiangTaklo, Maaike M VHandbook of wafer bondingEngineeringWritten by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.Wileyoai:cds.cern.ch:16139902011
spellingShingle Engineering
Ramm, Peter
Lu, James Jian-Qiang
Taklo, Maaike M V
Handbook of wafer bonding
title Handbook of wafer bonding
title_full Handbook of wafer bonding
title_fullStr Handbook of wafer bonding
title_full_unstemmed Handbook of wafer bonding
title_short Handbook of wafer bonding
title_sort handbook of wafer bonding
topic Engineering
url https://dx.doi.org/10.1002/9783527644223
http://cds.cern.ch/record/1613990
work_keys_str_mv AT rammpeter handbookofwaferbonding
AT lujamesjianqiang handbookofwaferbonding
AT taklomaaikemv handbookofwaferbonding

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