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Handbook of wafer bonding
Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most...
Autores principales: | Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M V |
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Lenguaje: | eng |
Publicado: |
Wiley
2011
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1002/9783527644223 http://cds.cern.ch/record/1613990 |
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