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Three-dimensional integration and modeling: a revolution in RF and wireless packaging
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Morgan & Claypool Publishers
2007
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| Acceso en línea: | http://cds.cern.ch/record/1614172 |