Three-dimensional integration and modeling: a revolution in RF and wireless packaging

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...

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Detalles Bibliográficos
Autores principales: Lee, Jong-Hoon, Tentzeris, Manos M
Lenguaje:eng
Publicado: Morgan & Claypool Publishers 2007
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/1614172
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author Lee, Jong-Hoon
Tentzeris, Manos M
author_facet Lee, Jong-Hoon
Tentzeris, Manos M
author_sort Lee, Jong-Hoon
collection CERN
description This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.Table of Contents: I
id cern-1614172
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2007
publisher Morgan & Claypool Publishers
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spelling cern-16141722021-04-21T22:10:28Zhttp://cds.cern.ch/record/1614172engLee, Jong-HoonTentzeris, Manos MThree-dimensional integration and modeling: a revolution in RF and wireless packagingEngineeringThis book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.Table of Contents: IMorgan & Claypool Publishersoai:cds.cern.ch:16141722007
spellingShingle Engineering
Lee, Jong-Hoon
Tentzeris, Manos M
Three-dimensional integration and modeling: a revolution in RF and wireless packaging
title Three-dimensional integration and modeling: a revolution in RF and wireless packaging
title_full Three-dimensional integration and modeling: a revolution in RF and wireless packaging
title_fullStr Three-dimensional integration and modeling: a revolution in RF and wireless packaging
title_full_unstemmed Three-dimensional integration and modeling: a revolution in RF and wireless packaging
title_short Three-dimensional integration and modeling: a revolution in RF and wireless packaging
title_sort three-dimensional integration and modeling: a revolution in rf and wireless packaging
topic Engineering
url http://cds.cern.ch/record/1614172
work_keys_str_mv AT leejonghoon threedimensionalintegrationandmodelingarevolutioninrfandwirelesspackaging
AT tentzerismanosm threedimensionalintegrationandmodelingarevolutioninrfandwirelesspackaging

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