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Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers...

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Detalles Bibliográficos
Autor principal: Balasinski, Artur
Lenguaje:eng
Publicado: Springer 2013
Materias:
Acceso en línea:https://dx.doi.org/10.1007/978-1-4614-1761-3
http://cds.cern.ch/record/1625531