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Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers...

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Detalles Bibliográficos
Autor principal: Balasinski, Artur
Lenguaje:eng
Publicado: Springer 2013
Materias:
Acceso en línea:https://dx.doi.org/10.1007/978-1-4614-1761-3
http://cds.cern.ch/record/1625531
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author Balasinski, Artur
author_facet Balasinski, Artur
author_sort Balasinski, Artur
collection CERN
description This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
id cern-1625531
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2013
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spelling cern-16255312021-04-21T21:42:00Zdoi:10.1007/978-1-4614-1761-3http://cds.cern.ch/record/1625531engBalasinski, ArturDesign for manufacturability: from 1D to 4D for 90-22 nm technology nodesEngineeringThis book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. ·         Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm  technology nodes; ·         Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package;  ·         Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources; ·         Helps readers to translate reliability methodology into real design flows.Springeroai:cds.cern.ch:16255312013
spellingShingle Engineering
Balasinski, Artur
Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
title Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
title_full Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
title_fullStr Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
title_full_unstemmed Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
title_short Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
title_sort design for manufacturability: from 1d to 4d for 90-22 nm technology nodes
topic Engineering
url https://dx.doi.org/10.1007/978-1-4614-1761-3
http://cds.cern.ch/record/1625531
work_keys_str_mv AT balasinskiartur designformanufacturabilityfrom1dto4dfor9022nmtechnologynodes