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Design for manufacturability: from 1D to 4D for 90-22 nm technology nodes
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers...
Autor principal: | Balasinski, Artur |
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Lenguaje: | eng |
Publicado: |
Springer
2013
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1007/978-1-4614-1761-3 http://cds.cern.ch/record/1625531 |
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