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Wire bonding in microelectronics
Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge t...
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| Lenguaje: | eng |
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McGraw-Hill
2010
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| Acceso en línea: | http://cds.cern.ch/record/1644564 |