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Through Silicon Via (TSV) Experience in Medipix
| Autor principal: | |
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| Lenguaje: | eng |
| Publicado: |
2014
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1670683 |
| _version_ | 1780935580555673600 |
|---|---|
| author | CAMPBELL, Michael |
| author_facet | CAMPBELL, Michael |
| author_sort | CAMPBELL, Michael |
| collection | CERN |
| id | cern-1670683 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2014 |
| record_format | invenio |
| spelling | cern-16706832022-11-02T22:17:43Zhttp://cds.cern.ch/record/1670683engCAMPBELL, MichaelThrough Silicon Via (TSV) Experience in MedipixACES 2014 - Fourth Common ATLAS CMS Electronics Workshop for LHC Upgrades SLHCoai:cds.cern.ch:16706832014 |
| spellingShingle | SLHC CAMPBELL, Michael Through Silicon Via (TSV) Experience in Medipix |
| title | Through Silicon Via (TSV) Experience in Medipix |
| title_full | Through Silicon Via (TSV) Experience in Medipix |
| title_fullStr | Through Silicon Via (TSV) Experience in Medipix |
| title_full_unstemmed | Through Silicon Via (TSV) Experience in Medipix |
| title_short | Through Silicon Via (TSV) Experience in Medipix |
| title_sort | through silicon via (tsv) experience in medipix |
| topic | SLHC |
| url | http://cds.cern.ch/record/1670683 |
| work_keys_str_mv | AT campbellmichael throughsiliconviatsvexperienceinmedipix AT campbellmichael aces2014fourthcommonatlascmselectronicsworkshopforlhcupgrades |