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Perspectives of 65 nm CMOS technologies for high performance front-end electronics

The 65 nm CMOS generation is currently being evaluated as a promising solution for the integration of high speed circuits with high functional density in a small pixel. This technology node has specific features, such as new materials introduced to limit the current tunneling through the thin dielec...

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Detalles Bibliográficos
Autores principales: Traversi, G, Manghisoni, M, Re, V, Gaioni, L, Ratti, L
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: 2014
Materias:
Acceso en línea:http://cds.cern.ch/record/1693462
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author Traversi, G
Manghisoni, M
Re, V
Gaioni, L
Ratti, L
author_facet Traversi, G
Manghisoni, M
Re, V
Gaioni, L
Ratti, L
author_sort Traversi, G
collection CERN
description The 65 nm CMOS generation is currently being evaluated as a promising solution for the integration of high speed circuits with high functional density in a small pixel. This technology node has specific features, such as new materials introduced to limit the current tunneling through the thin dielectric, that need to be thoroughly investigated. In order to assess how these new physical parameters impact on the device properties, such as noise and radiation hardness, this paper presents and discusses the characterization of 65 nm CMOS transistors, in terms of intrinsic gain, gate leakage current and noise performance, before and after irradiation with g-rays. A comparison with data coming from less scaled technologies is also provided.
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spelling cern-16934622019-09-30T06:29:59Z http://cds.cern.ch/record/1693462 eng Traversi, G Manghisoni, M Re, V Gaioni, L Ratti, L Perspectives of 65 nm CMOS technologies for high performance front-end electronics Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection The 65 nm CMOS generation is currently being evaluated as a promising solution for the integration of high speed circuits with high functional density in a small pixel. This technology node has specific features, such as new materials introduced to limit the current tunneling through the thin dielectric, that need to be thoroughly investigated. In order to assess how these new physical parameters impact on the device properties, such as noise and radiation hardness, this paper presents and discusses the characterization of 65 nm CMOS transistors, in terms of intrinsic gain, gate leakage current and noise performance, before and after irradiation with g-rays. A comparison with data coming from less scaled technologies is also provided. info:eu-repo/grantAgreement/EC/FP7/262025 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/1693462 2014
spellingShingle Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Traversi, G
Manghisoni, M
Re, V
Gaioni, L
Ratti, L
Perspectives of 65 nm CMOS technologies for high performance front-end electronics
title Perspectives of 65 nm CMOS technologies for high performance front-end electronics
title_full Perspectives of 65 nm CMOS technologies for high performance front-end electronics
title_fullStr Perspectives of 65 nm CMOS technologies for high performance front-end electronics
title_full_unstemmed Perspectives of 65 nm CMOS technologies for high performance front-end electronics
title_short Perspectives of 65 nm CMOS technologies for high performance front-end electronics
title_sort perspectives of 65 nm cmos technologies for high performance front-end electronics
topic Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
url http://cds.cern.ch/record/1693462
http://cds.cern.ch/record/1693462
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