Tests of the First Three-Dimensionally Integrated

We report on the results from testing of the first three-dimensionally integrated readout chip for pixel detectors, which application is in X-ray Photon Correlation Spectroscopy (XPCS) experiments on light sources. The chip was designed in the 130nm Tezzaron/GF process as a two-tier device with effe...

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Detalles Bibliográficos
Autores principales: Maj, P, Carini, G, Deptuch, G, Grybos, P, Kmon, P, Siddons, D P, Szczygiel, R, Trimpl, M, Yarema, R
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: 2014
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:http://cds.cern.ch/record/1693463

Internet

http://cds.cern.ch/record/1693463

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