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Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding....
Autores principales: | , , , , , , , |
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Formato: | info:eu-repo/semantics/article |
Lenguaje: | eng |
Publicado: |
Nucl. Instrum. Methods Phys. Res., A
2014
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/j.nima.2014.05.046 http://cds.cern.ch/record/1693467 |